Semiconductor Supply Chain Watch: TSMC reported July sales of NT$467.58 billion (about US$14.5B), up 44.7% year on year, with AI-related demand still “extremely robust,” reinforcing the AI hardware spending surge. Next-Gen Packaging: TSMC completed a production line for next-generation CoPoS packaging (Chip on Panel on Substrate) at its Advanced Packaging Fab 7 in Chiayi, with yields and tech expected to stabilize over about a year. Image Sensor Push: Sony and TSMC plan a US$6.3B image-sensor venture in Japan, targeting mass production as early as 2029 and aiming to supply high-performance sensors for Apple iPhone. Security & Talent Risks: Taiwan’s Investigation Bureau said it uncovered 17 Chinese companies illegally poaching high-tech talent in Taiwan, spanning semiconductors and batteries—another reminder that tech competition is also a people-and-know-how fight. Defense Tech Angle: Taiwan is scaling drone production and building drone fleets to deter a potential Chinese invasion, drawing on battlefield lessons. Regional Tech Economy: Singapore upgraded 2026 growth and NODX forecasts, citing AI-driven electronics demand—Taiwan remains a key export contributor. Space Industry (Regional): Vietnam’s VinSpace signed a launch contract with SpaceX for 2027 rideshare missions, moving toward full-stack satellite capabilities. Policy/People: A guide to Taiwan’s APRC rules highlights 2026 requirements, including residence and income thresholds.