AGP Executive Report
Last update: an hour agoAI Chips & Taiwan Supply Chain: Meta says it will start manufacturing its in-house AI accelerator “Iris” in September, aiming to double computing capacity to 14GW by 2027, with Taiwan Semiconductor Manufacturing Co (TSMC) set to manufacture the chip and Broadcom helping with design. Semiconductor Capacity Moves: Micron broke ground on a ¥1.5T (US$9.3B) Japan expansion to produce AI-focused HBM, with shipments targeted for 2028, while GlobalFoundries cleared production readiness for its SLATE wafer-to-wafer bonding tech for smaller stacked dies. Local Tech Industry Expansion: TSMC will build three more advanced packaging fabs in Chiayi Science Park Phase II, targeting a larger regional advanced packaging cluster. Cybersecurity & Privacy: China’s MIIT warned that certain Claude Code versions may secretly transmit sensitive user data via a built-in monitoring mechanism, urging uninstalling or upgrading. Cross-Strait Security & Data Risks: A Taipei court judge described how CCP spy recruitment in Taiwan has shifted toward networked, low-value “routine” information gathered through social platforms and lawful-looking channels. Geopolitics & Maritime Law: Taiwan reiterated its South China Sea “Four Principles” as the 10th anniversary of the arbitration ruling passed, while China’s “Batanes” narrative drew renewed pushback. Weather Disruption: Typhoon Bavi battered Taiwan and eastern China, injuring 134 in Taiwan and evacuating millions across the mainland.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.
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