AGP Executive Report
Last update: 40 minutes agoTSMC Momentum: June revenue hit a record NT$442.68B (+67.9% YoY), lifting Q2 sales to about NT$1.27T (+36%), with AI chip demand still driving the pace. Advanced Packaging Push: TSMC plans more advanced packaging capacity in Chiayi, including two new packaging plants and additional fabs tied to its AI hub buildout. AI Chip Race in Phones: Reports say Google’s Tensor G6 for Pixel 11 could be the first phone chip made on TSMC’s 2nm process, potentially beating Apple’s expected iPhone 18 Pro timing. Meta’s In-House Compute: Meta’s memo says it will double AI computing capacity to 14GW by 2027 and start in-house AI chip production in September, with Iris accelerators tied to TSMC. Security & Supply Chain Risks: Taiwan’s military outsourcing plan for academy guard duties faces concern over security vulnerabilities amid rising espionage claims. Tech Policy & Trust: China warned that some Anthropic Claude Code versions may secretly transmit sensitive user data, urging uninstall/upgrade. Global Market Shock: Renewed U.S.-Iran tensions around the Strait of Hormuz spiked oil and rattled stocks, adding pressure to AI valuations. Food Safety Clarity: Taiwan’s TFDA denied online claims about changing fipronil limits for apples, saying the issue involves fenpropathrin and crop-specific rules.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.
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