AGP Executive Report
Last update: an hour agoAI Infrastructure & Data Centers: SAIGONTEL and partners unveiled a plan for a $3.5B AI data centre complex in Tay Ninh, targeting Tier IV uptime, direct liquid/immersion cooling, up to 150kW per rack, and sub-18ms latency to Singapore. Cybersecurity: Bloomberg reports Chinese-linked hacker activity has more than doubled after groups adopted AI tools (including DeepSeek) to automate reconnaissance, scanning, and even malware development. Semiconductors & Supply Chains: A Goldman Sachs analysis says China’s advanced-chip supply deficit could shrink to 34% by 2035, but lithography remains a binding constraint; separately, China’s NDRC claims chip equipment “full-chain synergy” as domestic tool share hits 35% (with key components still foreign-dependent). Taiwan Industry Compliance: Taiwan prosecutors searched Unimicron over alleged “origin washing,” accusing the firm of relabeling China-made PCBs as Taiwan-made. Public Tech & Safety: Taiwan’s CWA says automated weather stations are getting disrupted by wildlife like squirrels chewing cables, while Taipei’s child protection system faces rising invalid reports flagged by an audit. Health Tech Research: A stroke-risk AI study was corrected after a published SHAP ranking figure was wrong, underscoring the importance of model explainability in clinical use. Materials for Chips: Henkel launched Loctite ABLESTIK CDF900 conductive die attach film at SEMICON Taiwan, targeting higher thermal conductivity for AI/HPC packaging demands.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.