AGP Executive Report
Last update: 2 hours agoSmartphone Chips (Taiwan): MediaTek just unveiled the Dimensity 9600 Pro (TSMC 2nm) and Dimensity 9600M (TSMC 3nm), aiming squarely at Qualcomm’s premium turf with on-device AI gains and faster prompt-to-response claims. Chipmaking Ecosystem: ASML says High-NA EUV is now at production readiness with 10 systems operating at four chipmakers, while it breaks ground on a second campus in Eindhoven to scale supply. AI Hardware & Power: Meta plans to deploy its next in-house AI chip in data centers, targeting better performance per watt and working with TSMC for manufacturing. China Mobility Controls: New China exit-entry rules took effect, expanding legal tools to restrict departures tied to “industrial or technological security,” with separate measures affecting visa statements. Taiwan Research & Health: NYCU researchers report ongoing natural selection shaping disease susceptibility in Taiwan’s population, and Taiwan’s CDC says flu cases are rising and expected to peak around Mid-Autumn. Cybersecurity: Researchers disclosed a mass-scanning campaign exploiting a Vite flaw to steal cloud credentials and configs from exposed dev servers. Education & Talent: Taiwan sends 53 professionals to the WorldSkills Competition in Shanghai, while IIT Hyderabad first-year BTech students won a TECO International Contest award in Taiwan. Markets Watch: Global tech stocks wobbled after renewed calls for slowing AI development, while oil and yields kept pressuring sentiment.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.