AGP Executive Report
Last update: 2 hours agoSmartphone Chips (Taiwan): MediaTek just unveiled the Dimensity 9600 Pro (TSMC 2nm) and Dimensity 9600M (TSMC 3nm), aiming squarely at Qualcomm’s premium turf with on-device AI gains and faster prompt-to-response claims. Chipmaking Ecosystem: ASML says High-NA EUV is now at production readiness with 10 systems operating at four chipmakers, while it breaks ground on a second campus in Eindhoven to scale supply. AI Hardware & Power: Meta plans to deploy its next in-house AI chip in data centers, targeting better performance per watt and working with TSMC for manufacturing. China Mobility Controls: New China exit-entry rules took effect, expanding legal tools to restrict departures tied to “industrial or technological security,” with separate measures affecting visa statements. Taiwan Research & Health: NYCU researchers report ongoing natural selection shaping disease susceptibility in Taiwan’s population, and Taiwan’s CDC says flu cases are rising and expected to peak around Mid-Autumn. Cybersecurity: Researchers disclosed a mass-scanning campaign exploiting a Vite flaw to steal cloud credentials and configs from exposed dev servers. Education & Talent: Taiwan sends 53 professionals to the WorldSkills Competition in Shanghai, while IIT Hyderabad first-year BTech students won a TECO International Contest award in Taiwan. Markets Watch: Global tech stocks wobbled after renewed calls for slowing AI development, while oil and yields kept pressuring sentiment.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.
Perspectify News
